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• ARTICLE IV <br /> ISSUANCE OF THE SERIES 2008 BONDS <br /> Section 4.1. Issuance of the Series 2008 Bonds. The Issuer shall issue the Bonds under <br /> and in accordance with the Indenture. The Company hereby approves the issuance of the Bonds and <br /> all terms and conditions thereof. <br /> Section 4.2. Disposition of Bond Proceeds. The proceeds from the issuance and sale of <br /> the Series 2008 Bonds shall be disbursed to the Company from time to time for payment of Project <br /> Costs or reimbursement of Proj ect Costs paid or to be paid by the Company or its affiliates incidental <br /> to the acquiring, constructing and equipping of the Project, in accordance with and pursuant to <br /> requisitions as provided in Section 602 of the Indenture. <br /> • <br /> • <br /> 11 <br />